Making History With Rosettanet
ChipPAC is one of the world's largest providers of semiconductor packaging design, assembly, test and distribution services. This includes a full array of packaging options from basic 6-pin to 2000-pin BGA/CSP and leadframe packages. These packages are offered in wire-bond and flip-chip processes.
From its inception, ChipPAC has been one of the industry's top assembly and test foundries, providing solutions to several large customers requiring high performance technology solutions to support their business requirements.
Globetronics Case Studies
Globetronics is a dynamic Malaysian corporation providing a wide range of value-added products and services in the semiconductor sector. It is a full-fledged IC contract manufacturer, specialising in Ceramic, Cerdip packages, PCB and RF assembly and Tape & Reel services. Its assembly/test facilities support military, automotive and commercial requirements.