To ease the transition to Windows Embedded CE 6.0 R3, you’ll find the extensive
portfolio of Board Support Packages (BSPs) currently available for Windows Embedded CE 6.0 R2 to be fully compatible with this new release. Microsoft works closely with silicon vendors to offer BSPs for a wide range of microprocessors and other hardware components.
Our goal is to simplify your search for compatible BSPs that will let you rapidly: