{"id":863424,"date":"2022-07-20T13:24:16","date_gmt":"2022-07-20T20:24:16","guid":{"rendered":"https:\/\/www.microsoft.com\/en-us\/research\/"},"modified":"2022-07-20T13:24:16","modified_gmt":"2022-07-20T20:24:16","slug":"reliability-of-pfet-eeprom-with-70-spl-aring-tunnel-oxide-manufactured-in-generic-logic-cmos-processes","status":"publish","type":"msr-research-item","link":"https:\/\/www.microsoft.com\/en-us\/research\/publication\/reliability-of-pfet-eeprom-with-70-spl-aring-tunnel-oxide-manufactured-in-generic-logic-cmos-processes\/","title":{"rendered":"Reliability of pFET EEPROM with 70-\/spl Aring\/ tunnel oxide manufactured in generic logic CMOS Processes"},"content":{"rendered":"<p>We investigate the reliability of pFET-based EEPROMs with 70-\/spl Aring\/ tunneling oxides fabricated in standard foundry 0.35-\/spl mu\/m, 0.25-\/spl mu\/m, and 0.18-\/spl mu\/m logic CMOS processes. The floating-gate memory cell uses Fowler-Nordheim tunneling erase and impact-ionization generated hot-electron injection for programming. We show that charge leakage is dominated by the leakage through interlayer dielectrics. We propose a retention model and show the data retention lifetime exceeds 10 years. These results demonstrate the feasibility of producing nonvolatile memory using standard logic processes that have a 70-\/spl Aring\/ oxide.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>We investigate the reliability of pFET-based EEPROMs with 70-\/spl Aring\/ tunneling oxides fabricated in standard foundry 0.35-\/spl mu\/m, 0.25-\/spl mu\/m, and 0.18-\/spl mu\/m logic CMOS processes. The floating-gate memory cell uses Fowler-Nordheim tunneling erase and impact-ionization generated hot-electron injection for programming. We show that charge leakage is dominated by the leakage through interlayer dielectrics. 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