IEEE International Workshop on Hot Topics in 3D – Hot3D

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The 3D community continues to innovate and evolve, with greater focus on enabling augmented reality and virtual reality (AR/VR) experiences. There have been amazing breakthroughs on 3D capture and acquisition, and a great deal of study on various representation models, including light fields, point clouds, meshes and holographic data. 3D display technology continues to advance and head-mounted displays are becoming more popular. Additionally, more realistic 3D scene generation has been enabled, and 3D audio has the potential to enhance the immersive experience through advanced sound field rendering methods.

While appropriate venues for presenting research at advanced stages are plentiful, the 3D multimedia community needs an appropriate venue for receiving feedback during early or initial stages of the development of radical and potentially disruptive technologies. This is the void that Hot3D tries to fill.

Topics of interest include, but are not limited to 3D aspects of:

  • Acquisition: microlens arrays, multi-camera, depth sensing, holography
  • Representation: light fields, point clouds, meshes, holography
  • Processing: filtering, stereo, calibration, registration
  • Compression: functionalities (scalability, random access, error resilience, etc.) and tools (transforms, prediction, quantization, etc.)
  • Rendering: modeling, synthesis, surface reconstruction
  • Display: free viewpoint, multiview, head-mounted, holographic
  • Quality: objective metrics, subjective methodologies, user experience issues
  • Application Scenarios: requirements, functionalities, experiences
Early stage work with preliminary results from potentially disruptive technology are particularly encouraged. Full papers (up to 6 pages) will be published in the ICME 2017 proceedings and included in IEEE Xplore. Additionally, position papers (up to 2 pages) are solicited for short presentation and discussion.
The 1-day workshop will be co-located with ICME, the flagship multimedia conference sponsored by four IEEE societies. The workshop will be a unique opportunity to interact with other researchers working in the field, with a program designed to facilitate discussion and feedback in early stage research.
More information is always available at (opens in new tab)

The 2017 Hot3D will be help in Hong Kong.

Please visit this year’s website for more info: (opens in new tab)